A surprising partnership was recently announced between Intel and its rival AMD to produce thinner, sleeker PCs that will come with discrete graphics and high-performance processors as opposed to high-end laptops that include Intel Core H-series CPUs combined with high-end discrete graphics from AMD and NVIDIA. These types of systems usually feature a thickness of 26mm, and modern, premium laptops are usually 16mm or less.
EMIB, the heart of the next-generation laptops
In order to deliver high performance without compromising thickness of these devices, Intel is combining Embedded Multi-Die Interconnect Bridge (EMIB) technology with a brand new power-sharing framework. EMIB is a small intelligent bridge that allows heterogeneous silicon to pass information quickly in very close proximity. It also eliminates height impact and design and manufacturing complexities. EMIB enables faster and more powerful, more efficient products that come in smaller sizes.
Intel worked with AMD to design a new semi-custom graphics chip
Intel’s future 8th generation Intel Core CPU will include the high-performing Intel Core H-series processor sporting second generation high bandwidth memory and a custom-for-Intel third party discrete graphics chip from AMD’s Radeon in a single processor package.
The new semi-custom graphics chip reduces the silicon footprint to half and allows OEMs to design thinner, lighter designs that will also come with improved thermal dissipation. PC battery life also benefits.
Gamers and content creators get thinner, lighter PCs
This collaboration between Intel and AMD will provide both gamers and content creators lighter, thinner PCs that will be able to deliver discrete graphics experiences in AAA games and content creation apps. The new graphics card will place the fantastic performance and capabilities of Radeon graphics into the hands of enthusiasts who want the best visual experience.
We’ll know more details on this amazing collaboration during the first quarter of next year.
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