Intel Foundry Back in Spotlight as MediaTek Tipped to Tap 14A Process for Dimensity Chips

Intel, which is well-known for manufacturing custom silicon for Microsoft hardware, has now been linked to MediaTek. The same MediaTek that sits right next to Qualcomm when we talk of mobile chips.

Intel may have roped in MediaTek as a foundry customer

That’s according to a new rumor, which suggests that Intel may be lining up MediaTek as a potential foundry customer. If true, future Dimensity chips could come to Intel’s upcoming 14A process.

Wccftech, which covered the rumor, reports that MediaTek is exploring Intel’s most advanced manufacturing node for future smartphone SoCs. There’s no official confirmation from either side. However, the idea has sparked discussion around Intel’s push to grow its foundry business and compete at the very top end of chip manufacturing.

Not to mention, landing a high-volume client like MediaTek would be a big win for Intel. Mobile chips ship in massive numbers, and a deal like this would hint at growing confidence in Intel Foundry’s roadmap.

Concerns around Backside Power Delivery (BPD)

That said, the rumor also raises some real questions. One of the biggest concerns reportedly revolves around Intel’s aggressive shift to Backside Power Delivery (BPD) on its advanced nodes. In theory, BSPD improves power routing and frees up space on the front of the chip. In practice, reported performance gains appear modest. More importantly, the design can increase self-heating, which is a serious issue for smartphone chips operating under tight thermal limits.

That makes Intel’s 14A process a tricky fit for mobile SoCs like Dimensity. Intel could address these challenges through new layouts or thermal optimizations, but nothing has been confirmed so far. If the rumor turns out to be accurate, MediaTek would give Intel Foundry a much-needed credibility boost and could help attract more customers to its advanced nodes. As always, take this rumor with a grain of salt.